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21st April 2025 (15 Topics)

Angstrom-scale chips

Context

Scientists from the Indian Institute of Science (IISc) has proposed a cutting-edge research initiative to develop next-generation angstrom-scale semiconductor chips — much smaller than current chips. The focus is on using 2D materials (a new class of semiconductors) to replace silicon and push chip miniaturization beyond current limits.

What Are Angstrom-Scale Chips?

  • An angstrom (Å) is 1 nanometers (1 Å = 0.1 nm = 10?¹? meters). It is one-tenth the thickness of today's chips.
  • Current leading-edge chips are at 3 nanometer scale, made by global tech giants like Samsung, TSMC, and MediaTek.
  • Angstrom-scale chips aim to reduce this by up to 10 times, enabling faster, smaller, and more energy-efficient electronics.
  • To achieve this, researchers must go beyond conventional silicon-based semiconductors. This is where 2D materials such as graphene and transition metal dichalcogenides (TMDs) enter the picture. These extremely thin materials may be used to construct the next generation of high-performance, energy-efficient chips.
  • This marks a paradigm shift in semiconductor engineering, as traditional silicon reaches its physical limits of miniaturization.

What Are 2D Materials?

  • 2D materials are ultra-thin layers of material, typically just one atom thick.
  • The most famous example is graphene (carbon atoms arranged in a honeycomb lattice), but many others exist — molybdenum disulfide (MoS?), hexagonal boron nitride (h-BN), etc.
  • These materials have excellent electrical, thermal, and mechanical properties.
  • They are ideal candidates for next-generation semiconductors because they can:
    • Maintain conductivity at ultra-small thicknesses
    • Reduce heat loss
    • Enable heterogeneous chip design (integrating different materials on one chip)

India’s Semiconductor Ecosystem:

  •   India launched the Semicon India Programme in 2021 with incentives to attract chip fabs.
  • The largest approved fab is a Rs 91,000 crore Tata-PSMC (Taiwan) project in Gujarat.
  • While manufacturing is one part, deep R&D in materials science and design (like IISc’s project) is essential to move up the value chain.
  • India must invest not just in chip factories, but also in intellectual property, innovation, and technology leadership.
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